Kwinkalo yeshishini le-semiconductor namhlanje, ngophuhliso lwe-SMT, iindawo ezincinci zibe zincinci, ukuxinana okuphezulu kunye nesiseko senyani, kunye neendlela zophuhliso lwexesha elizayo ziya kuba yinxalenye encinci ye-miniaturization. Ukusukela kwi-chip mount, i-solder flux contamination adsorption nozzle ngenxa yokusilela rhoqo ukuvelisa impembelelo enkulu, ibe yingxaki engxamisekileyo ekufuneka isonjululwe.

Umatshini wokucoca umbhobho we-Auto QXJ-NC32 usebenzisa iindlela zokucoca i-pulse inokuba ludonga lwangaphakathi lombhobho ngexesha elifutshane, ngaphambi kokususa ukungcola akukwazi ukususwa, usebenzisa amanzi acocekileyo angeyotyhefu (ixabiso le-PH 5-7) xa ucoca ngaphandle kokulimaza i-nozzle.I-32 i-nozzles inokucocwa ngexesha elinye, kuquka i-Panasonic nozzles, i-FUJI i-nozzles, i-YAMAHA i-nozzles, njl.

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